![The CERES system in use in the University of Oregon Technical Sciences Administration center.](/web/image/25518/IMG_20211104_155129.jpg?access_token=9cb7df23-75f8-42bd-bfd1-c9ed522965c5)
According to the TSA “Our strategic investments in equipment and technology enable us to take on R&D, product development, and distinct prototyping projects with ease. We serve both university and non-university affiliates through our center.”
The purchase and installation of the CERES system adds microscale metal AM capabilities to the university’s already impressive array of tooling, and is a great step forward in the TSA’s mission to “harness University of Oregon’s nano-to-macro level manufacturing resources to unlock and promote experiential learning opportunities for communities”.
CERES can print 99% density copper structures (amongst other metals) with submicrometer resolution, at room temperature. These capabilities set it apart from other microscale AM technologies such as Two-Photon Polymerization (2PP), allowing CERES operators to print microscale metal structures directly in situ, such as lattices, micro pillar arrays, needles for neural interfaces, helices, or waveguides, directly on a chip surface.
At the time of writing, the University of Oregon is home to the only CERES system in the USA, making this a very exciting development in bringing this pioneering technology to a wider audience.
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