Beyond Fine Pitch.


The Future of Wafer Probing 
with 3D Printing


Moore's Law is under threat unless wafer probing evolves.

Shrinking component sizes and increased interconnect density needs dramatic innovation in probing technology to access finer pitch.

The limit of so-called "fine pitch" has long been reached, and for 10+ years there has been little progress in enabling testing smaller than 40 µm pitch.

What's the solution?

A close-up photo of semiconductor dies on a wafer. Source: Laura Ockel, Unsplash (free usage)
A rendered image of Exaddon's micro 3D printing technology printing a probe for semiconductor testing.


Innovation is Required to Reach Smaller Pitch

Current methods are not able to match the demand from industry, and chip designers have long had to compromise with DfT (design for test) considerations.

The lack of flexibility in probe design, probe pitch, and space transformer availability are all bottlenecks to continued scaling. In the face of increasingly complex wafer packaging solutions, probe testing needs to innovate.  

Access <20 µm Pitch with 3D Printing

An SEM image of an array of 3D printed fine-pitch probes for semiconductor probe testing, produced by Exaddon

Unprecedented Possibilities

An SEM image of 3D printed probes with an alternating 18.5 µm / 35.5 µm pitch

 
 


Innovation for Continued Scaling

See how Exaddon's probe printing is changing chip design and probe testing

3D Printing: Unparalleled Possibilities in Customization, Pitch, & Lead Time

A close up SEM image of an array of 3D printed fine-pitch probes for semiconductor probe testing, produced by Exaddon
Beyond Fine Pitch

Contact pads and bumps at
less than 20 µm pitch

An SEM image of a fine-pitch array of metal microcoils, 3D printed by Exaddon.
Endless Customization

Template-free 3D printing for
amazing design freedom

Low Lead Time

Iterate designs fast;
maximize uptime & yield


A rendered image of Exaddon's micro 3D printing technology printing a triple coil on a microPCB.

How Does it Work?

Template-free 3D Printing via Local Electrodeposition
No heat, no lasers, no layers. Metal is deposited directly in place, with submicrometer resolution.

Printed material is mechanically stable with excellent conductivity and tensile strength.  Read about the material properties here.

Discover the full process and specs in the whitepaper below.

DISCOVER  3D MICROPRINTED PROBES - READ THE WHITEPAPER